Grinding wheel

Sapphire chips are the key components in the process of LED producing (The hardness of sapphire is only second to diamond). The 2” and 4” sapphire chips need to be thinned from thickness 450 um to 120 um through grinding process. To aimed at this kind of tough material and high quality grinding requirement, Seuratek ,especially designed the unique verified bond and super hard diamond abrasive, provided the best solution for the sapphire industries through combine the excellent cutting ability and porosity character of vitrified bond and with special knife-head arrangement design.
 Sapphire backgrinding
子網頁 (1): Sapphire Ingot & wafer