seuratek co ltd
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Semiconductor Dep.
Dressing Brd.
Grinding wheel
Laser Protective Coating
Wafer Grinding
協作平台地圖
Contact Info
Gobal contact: Perry
Email:chunhsiunglee@gmail.com
Semiconductor Dep.
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Grinding wheel
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Sapphire Ingot & wafer
Cylinder
**晶棒出貨產品SPEC表格**
Wafer
Features:
1.We can cut in C plane or M plane
2.Customized in size or round shape or oval shape
3. Watch surface used or Camera used.
**晶片出貨產品SPEC表格**
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